Complete Semiconductor Manufacturing Process Solutions

Semiconductor Film
Thickness Solutions

Professional film thickness measurement solutions for semiconductor manufacturing processes, covering photoresist, dielectric layers, metal layers, barrier layers, passivation layers and other key process steps.

Semiconductor Film Thickness Measurement

Application Background

Semiconductor manufacturing involves various thin film processes; film thickness is a key parameter affecting device performance and yield

Importance of Thin Film Measurement

  • Device Performance

    Thin film thickness directly affects electrical, optical performance and reliability of devices

  • Process Uniformity

    Film thickness uniformity on wafer surface is an important indicator of process quality

  • Yield Control

    Precise thin film measurement helps improve production yield and reduce manufacturing costs

Semiconductor Thin Film Measurement Requirements

Thickness Range 1 nm - 300 μm
Uniformity Requirement ±1% - ±5%
Measurement Accuracy ±0.1 nm

Semiconductor Film Thickness Solutions

Professional measurement solutions for thin film measurement needs throughout semiconductor manufacturing

Photoresist Measurement

Supports thickness measurement of positive resist, negative resist, photoresist stripper and other photolithography materials with accuracy up to ±0.1nm.

  • Flexible filter configuration to prevent exposure
  • Supports single and multi-layer photoresist structures
  • Real-time monitoring of photoresist coating uniformity

Dielectric Layer Measurement

Precisely measure thickness and optical constants of dielectric films such as silicon oxide, silicon nitride, and aluminum oxide.

  • SiO₂, Si₃N₄, Al₂O₃ and other materials
  • Supports single or multi-layer film structures
  • Automatic film model recognition and fitting

Metal Layer Measurement

Measure aluminum, copper, titanium, tungsten and other metal film thicknesses, supporting metal multi-layer structure analysis.

  • Al, Cu, Ti, W and other metal films
  • Supports metal multi-layer and composite structures
  • High sensitivity detection, sub-nanometer accuracy

Barrier Layer Measurement

Precisely measure barrier layer film thickness such as titanium nitride and tantalum nitride to ensure device reliability.

  • TiN, TaN and other barrier layer materials
  • Ultra-thin film detection capability (<5nm)
  • Uniformity and consistency analysis

Passivation Layer Measurement

Measure passivation layer thickness such as silicon nitride and silicon oxide to ensure long-term device stability.

  • Si₃N₄, SiO₂ and other passivation layer materials
  • Multi-layer passivation film system analysis
  • Defect detection and quality evaluation

TSV Insulation Layer Measurement

Insulation layer thickness measurement for through-silicon via (TSV) processes, supporting 3D packaging applications.

  • TSV insulation layer: 50nm - 2μm
  • High aspect ratio structure support
  • 3D packaging process compatibility

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