Professional film thickness measurement solutions for semiconductor manufacturing processes, covering photoresist, dielectric layers, metal layers, barrier layers, passivation layers and other key process steps.
Semiconductor manufacturing involves various thin film processes; film thickness is a key parameter affecting device performance and yield
Device Performance
Thin film thickness directly affects electrical, optical performance and reliability of devices
Process Uniformity
Film thickness uniformity on wafer surface is an important indicator of process quality
Yield Control
Precise thin film measurement helps improve production yield and reduce manufacturing costs
Professional measurement solutions for thin film measurement needs throughout semiconductor manufacturing
Supports thickness measurement of positive resist, negative resist, photoresist stripper and other photolithography materials with accuracy up to ±0.1nm.
Precisely measure thickness and optical constants of dielectric films such as silicon oxide, silicon nitride, and aluminum oxide.
Measure aluminum, copper, titanium, tungsten and other metal film thicknesses, supporting metal multi-layer structure analysis.
Precisely measure barrier layer film thickness such as titanium nitride and tantalum nitride to ensure device reliability.
Measure passivation layer thickness such as silicon nitride and silicon oxide to ensure long-term device stability.
Insulation layer thickness measurement for through-silicon via (TSV) processes, supporting 3D packaging applications.
Professional measurement solutions for different application scenarios
For R&D and sampling inspection
For batch production monitoring
For online integration
Contact our technical team for customized semiconductor film thickness measurement solutions